A new angle on printing

Although blade contact angle is a critical stencil printing parameter, screen printers have so far
been unable to vary it ‘on-the-fly’, in software. The recently released Assembléon/Yamaha YGP
printer has changed this, and has made new application research possible to study a crucial
01005 process variable for feature printing that previous researchers have ignored.

We have designed the first robust solder paste printing process for 01005 components that uses only a single printer and stencil. We have studied transfer efficiencies across all the major
parameters, with important results for reliable high-density equipment assembly. Our findings
show that a variable blade contact angle can print fine features with wider process window, and
reduce overall process variation between boards produced from a line.

To read the full article, click here.