Are separate solder flip-chip bonders still required?

Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process of manufacturing modules requires placing both passives and (stacked) bare dies, these two types of placements are merging very quickly into a single platform. That raises the question of whether SMT equipment will take over from traditional die bonders.

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Authors:  Eric Klaver, Senior Product Manager, Assembléon
              Patrick Huberts, Product Manager Semicon market