Model management for predictive accuracy

The current trend of miniaturization in products and substrates is expected to continue in most advanced electronic products. Telecommunication and computer applications typically need high density connection boards incorporating smaller passive components, finer pitch IC’s and area array packages. The key factor in the technically successful evolution is the development of new interconnection processes, such as the use of conductive adhesive with very fine grained inter-connection materials. Consequence is that higher accuracy is required for placing Surface Mount Devices (SMD’s) at the carrier footprints (Figure 1), to ensure together with high precision placed bonding material the required bond quality. Moreover, very high economical pressures are pushing production facilities to assemble products at very low cost. This requires a continuous reduction in the number of rejects through reliable and stable (in control) assembly processes without the need of inspection systems.

Assembléon is market leader in providing high performances in both placement accuracy and output in the same machine. Its new AX placer (Figure 2) introduces the fine pitch component range capability into the parallel placement technology by the way of CCD component alignment cameras.

To read the full article. click here