Controlled Package on Package placement

A major challenge for electronic equipment manufacturers to continue miniaturizing their products is to increase their I/O counts from the same footprint. One solution is stacking – either of bare die products or packages (Package on Package). Assembléon is very active in both semiconductor back-end and embedded components applications. For semicon back end, stacking bare dies is challenging because of the need for cautious and accurate handling. The same applies for stacking packages, although less so. As the demand grows for smaller, lighter, higher-performance and increased functionality devices at much lower costs, package manufacture should keep costs under control, too.

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Author:  Eric Klaver, Senior Product Manager, Assembléon