Two international industry awards for Assembléon’s Twin Placement Robot

Veldhoven (Netherlands), 26 May 2011

Assembléon’s Twin Placement Robot, the latest addition to its A-Series pick & place equipment, has been received multiple innovation awards at this year’s Nepcon China in Shanghai. The Twin Placement Robot (TPR) received EM Asia’s Innovation award 2011 in the high volume assembly category. In the same category it also received the award for best exhibited technology from the SMT Association China.



The TPR is a pick & place solution for both chips and IC’s and can be mounted on any Assembléon AX-501 and AX-301. Not only at speed up to 111,000 components per hour, but also at high accuracy down to 10 micron. Mounted with multiple TPR’s the AX-501 and AX-301 can perfectly balance the load between passives and IC’s or flip chips on 1 machine platform. This turns the component mounters from Assembléon into a one-fit solution for both the PCB assembly industry as well as the Semicon/Backend industry.

Jeroen de Groot, Assembléon’s Senior Director for Marketing & Innovation, is very pleased with this positive result. “The awards for the TPR show that this new solution for our A-Series not only fits today’s needs in the electronics manufacturing industry, but also tomorrow’s requirements. We clearly see a trend that the SMT industry and the Semicon/Backend industry are coming more together. Our customers from both ends are crossing each other’s borders and express similar requests. Production equipment that not only mounts PCB’s but also fits technologies like die stacking, system-in-packages, embedded components and memory modules assembly will simplify processes for them. Thus improving their manufacturing efficiency. Our new TPR is very well fit to do this job.”

Although being a new addition in Assembléon’s portfolio, the Twin Placement Robot is already been named a standard for worldwide flash memory and DRAM manufacturer STEC. “The TPR system has exceeded all our requirements and expectations,” said Jose Del Valle, STEC’s Director of Offshore Engineering. “Because of the TPR, we are able to place Flash and DRAM at near 0402 speeds. We have increased throughput and accuracy while also decreasing changeover times. It has given us a true competitive manufacturing advantage, and it will continue to be part of our future standard configurations.”