ASSEMBLÉON INTRODUCES SCREEN PRINTER MCP

Veldhoven (Netherlands), 10 November 2009

Royal Philips Electronics subsidiary Assembléon is showing its new high speed, high quality MCP screen printer at Productronica 2009 (November 10-13, Hall A2, Stand 477). Assembléon’s MCP screen printer has an innovative head design with variable attack angle printing, allowing it to maintain constant solder pressure independent of the stencil thickness.  The single-head system also allows easy setup, and reduces maintenance by half.

With a board cycle time as low as 11 seconds, it is the first stencil printer to match the high throughput of some of today’s high-volume pick & place machines. It is the first printer to match their high quality, too, by reducing defect per million (dpm) figures by up to 50%. As a result, the MCP is ideal for high speed and high quality manufacturing, and is a perfect match for Assembléon’s single-digit dpm A-Series equipment and high-quality, high-mix MC-Series.

High precision, high speed printing

Component miniaturization and reduced component interspacing are challenging even to modern screen printers. While maintaining high output, screen printers should be able to handle a wide mix of components, down to 01005, with small interspacing (down to 100µm). They should also adapt to PCB material trends such as Flexible Printed Circuits (FlexFoil).

The MCP has a flat-metal single-head squeegee to improve the speed and quality of printing. The squeegee’s variable angle print head significantly improves the repeatability of the paste deposition for 01005 components, even after a stencil cleaning. The squeegee maintains constant solder pressure and produces perfect solder shapes with stencil thickness down to 50 µm and half edging stencils with stencil steps of 30 to 50 µm. It is ideal for PCBs mixing 01005 (0.4mm x 0.2mm) types with larger component sizes.