Challenges

In module manufacturing

Due to the fact that wafers are expensive and that rework is impossible, maximizing yield is important. Process complexity and the need to scale to higher volumes require highest possible first-pass yield.

Cost-effective and future-proof solutions

Modules facilitate increasing miniaturization and product diversity, and represent high value in end-user products. The cost of semiconductor manufacturing is continuing to climb and driving changes in the market. Emerging fab-less semiconductor companies are looking for cost-effective and future proof solutions like module manufacturing.

Highest production efficiency and uptime

Extensive process qualification and verification takes place before modules are ramped up to high volume. Every part of the process is tested, including production line, material flow and optimal process settings. Every process qualification run up until now has shown that the A-Series fully controls the situation and never fails on placement quality! The A-Series will help you achieve the highest production efficiency and uptime.

Flexibility in processes

The processes required to build a module package vary. Module manufacturers must be able to adapt and reconfigure their lines and processes according to the need to build a certain package at a certain volume.