Pick & Place equipment
Hardware solutions
The A-Series platform can be optionally extended with:
Integrated process features
- Flux dip station for dipping flipchips before placement. The controlled action prevents loss of component during fluxing.
- Pin transfer. COB die-attach application up to 2 x 2 mm is performed by a dedicated robot.
- Auxiliary feeder interface capable of handling 1 or more JEDEC tray stackers (Laurier) and/or direct die feeders (Hover Davis), and therefore provides a modular solution for many types of module applications including System-in-Package (SiP), Package-on-Package (PoP) and RF modules.
Accuracy features
- Flipchip camera for dies up to 6 mm with a bumpsize of 30 μm and 60μm interspacing for accurate placement of flipchips.
- More accurate robots, with accuracy down to 20 μm (scheduled July 2008)
Feeding features
- Direct die feeding from Hover Davis for up to 12” wafers. Directly offered by Unovis process solutions.
- Surftape tape solution for dies and flipchips, in which dies are handled as regular tape components and KGD only.
- JEDEC tray stacker from Laurier, 20/30 tray stack of same components in combination with long-stroke robot.
- Long-stroke robots capable of placing directly from tray, e.g. for memory modules.
