Software

Software features that contribute to a complete module manufacturing solution include:

Integrated process features

Active force control feedback that enables controlled placement. This check is used for pick, flux and place actions, and also senses board warpage.

Accuracy features

Fiducial grouping whereby module fiducials are grouped to optimize speed and accuracy settings.

Ability to detect deviation between the bump pattern and wafer saw pattern. Due to the regularity over a whole wafer, placement offset can be applied for all components on the wafer. This feature is patented by Assembléon.

Die feeding features

Wafer mapping in which it is possible to load a wafer map to a direct die feeder to increase the speed of picking Known Good Dies (KGD). All bad dies are skipped, because their position on the wafer is known.