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Do-it-yourself tips!
How to avoid empty feeders on your A-Series machines
Do not invent the wheel twice: reuse your data!
Preventive feeder maintenance made even easier
Easily raise your quality standards
Kick start your PCB production
Reduce the changeover time on your M-Series with 'feeder anywhere'
Fast changeover on your A-Series line
Improving efficiency and cost of manufacturing has never been so easy
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Let us introduce you to:
Guido de Cocq, team leader at Tooling
Joost Rietveld, test engineer at Assembléon's innovation department
Jürgen Seitner, Sales Manager South East Germany & Austria
Lenny Hoeberichts, customer support & service Europe
Michael Borcz, Senior Service and Applications Engineer
Sandro Caporal, sales manager in Italy
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ASSEMBLÉON TO HAND OVER THE 999TH A-SERIES MACHINE DURING NEPCON CHINA
ASSEMBLÉON SHOWS ITS NEW SMART SOLUTIONS AT APEX 2010
ASSEMBLÉON HIGHLIGHTS ELECTRICITY COST SAVINGS IN PICK & PLACE AT THIS YEAR’S IPC APEX.
ASSEMBLÉON INTRODUCES NEW IFLEX PICK & PLACE PLATFORM, INCREASING PCBA PRODUCTIVITY BY 30%
ASSEMBLÉON INTRODUCES A-SERIES HYBRID IN EUROPE AT PRODUCTRONICA
ASSEMPOL TO REPRESENT ASSEMBLÉON IN POLAND
Two international industry awards for Assembléon’s Twin Placement Robot
ASSEMBLÉON WINS THREE TOP PICK & PLACE AWARDS, ITS MC-24X NAMED BEST PRODUCT OF 2010
MULTIPLE AWARDS FOR ASSEMBLÉON AT IPC APEX EXPO
ASSEMBLÉON ANNOUNCES CHANGE OF CEO
PHILIPS INTENDS TO SELL ASSEMBLÉON
ICCO EMT REPORTS GOOD FIRST EXPERIENCE WITH IFLEX
ASSEMBLÉON INTRODUCES NEW IFLEX PICK & PLACE PLATFORM, INCREASING PCBA PRODUCTIVITY BY 30%
ASSEMBLÉON INTRODUCES SCREEN PRINTER MCP
ASSEMBLÉON PREMIERES YAMAHA’S NEW YS24
ASSEMBLÉON FEEDER TAKES 4-MM TAPE TO IMPROVE 01005 CHIP PLACEMENT AND REDUCE WASTE BY 75%
ASSEMBLÉON CONVERTS A-SERIES INTO IC SHOOTER, SHOWS AT NEPCON
ASSEMBLÉON INTRODUCES NEW IFLEX PICK & PLACE PLATFORM, INCREASING PCBA PRODUCTIVITY BY 30%
ASSEMBLÉON PROMOTES INTEGRATED PICK & PLACE APPROACH AT NEPCON SOUTH-CHINA IN SHENZHEN
Assembléon to address sustainability and flexible changeovers at NEPCON South China and IPC Midwest
ASSEMBLÉON WELCOMES NEW CEO
ASSEMBLÉON PARTNERS WITH VALOR
REDUCING CAPITAL COSTS OF EQUIPMENT ASSEMBLY
ASSEMBLÉON TO ENTER SEMICON INDUSTRY, INTRODUCING DEDICATED SOLUTION FOR SiP, MCM AND DIE BONDING
ASSEMBLÉON LAUNCHES NEW SERVICES FOR ITS A-SERIES AT PRODUCTRONICA
EUROPEAN INTRODUCTION OF THE MOST COMPACT PICK & PLACE PLATFORM AT SMT NUREMBERG
ASSEMBLÉON AIMS TO CUT PICK & PLACE OPERATING COSTS BY 30%
HIGH TECH CONSORTIUM STARTS SUPREME PROJECT
ASSEMBLÉON JOINS SUSTAINABLE ELECTRONICS MANUFACTURING WORKING GROUP
INVENTIVE FINANCING WITH TRUE CAPACITY ON DEMAND
ASSEMBLÉON ROBOT REDUCES COST OF MEMORY MODULE AND BACK-END SEMICONDUCTOR MANUFACTURING
NEW SOFTWARE FOR ASSEMBLÉON’S A-SERIES CUTS NPI TIME BY 30%
ASSEMBLÉON INTRODUCES EUROPEAN WEB SHOP
Press release archive
At Nepcon Shenzhen Assembléon shows True Capacity on Demand
The environmental impact of pick-and-place machines
True Capacity on Demand
Events
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Introducing at Productronica: Quality in a flexible package
Introducing at APEX Expo 2012: Quality in a flexible package
SMT Hybrid Packaging Nuremberg 2012
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Interviews on the iFlex
What does the press say about our new iFlex?
News from Assembléon
Welcome to Assembléon's new e-newsletter!
The journey continues after 2010....
An extra bonus!
Economy vs. ecology
Assembléon sponsors Electronics Day
It's all about leadership...
From the smartest region in the world...
iFlex: the next step
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Webshop Americas
March/April 2012
It’s “show season”!
Flexibility & Quality @ SMT show
How iFlex increases your high mix business
Jürgen Seitner
Traceability solutions
In small steps to great improvements
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