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Do-it-yourself tips!
- How to avoid empty feeders on your A-Series machines
- Do not invent the wheel twice: reuse your data!
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- Reduce the changeover time on your M-Series with 'feeder anywhere'
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About us
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About Assembléon
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Let us introduce you to:
- Guido de Cocq, team leader at Tooling
- Joost Rietveld, test engineer at Assembléon's innovation department
- Jürgen Seitner, Sales Manager South East Germany & Austria
- Lenny Hoeberichts, customer support & service Europe
- Michael Borcz, Senior Service and Applications Engineer
- Sandro Caporal, sales manager in Italy
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News & Events
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Press releases
- ASSEMBLÉON TO HAND OVER THE 999TH A-SERIES MACHINE DURING NEPCON CHINA
- ASSEMBLÉON SHOWS ITS NEW SMART SOLUTIONS AT APEX 2010
- ASSEMBLÉON HIGHLIGHTS ELECTRICITY COST SAVINGS IN PICK & PLACE AT THIS YEAR’S IPC APEX.
- ASSEMBLÉON INTRODUCES NEW IFLEX PICK & PLACE PLATFORM, INCREASING PCBA PRODUCTIVITY BY 30%
- ASSEMBLÉON INTRODUCES A-SERIES HYBRID IN EUROPE AT PRODUCTRONICA
- ASSEMPOL TO REPRESENT ASSEMBLÉON IN POLAND
- Two international industry awards for Assembléon’s Twin Placement Robot
- ASSEMBLÉON WINS THREE TOP PICK & PLACE AWARDS, ITS MC-24X NAMED BEST PRODUCT OF 2010
- MULTIPLE AWARDS FOR ASSEMBLÉON AT IPC APEX EXPO
- ASSEMBLÉON ANNOUNCES CHANGE OF CEO
- PHILIPS INTENDS TO SELL ASSEMBLÉON
- ICCO EMT REPORTS GOOD FIRST EXPERIENCE WITH IFLEX
- ASSEMBLÉON INTRODUCES NEW IFLEX PICK & PLACE PLATFORM, INCREASING PCBA PRODUCTIVITY BY 30%
- ASSEMBLÉON INTRODUCES SCREEN PRINTER MCP
- ASSEMBLÉON PREMIERES YAMAHA’S NEW YS24
- ASSEMBLÉON FEEDER TAKES 4-MM TAPE TO IMPROVE 01005 CHIP PLACEMENT AND REDUCE WASTE BY 75%
- ASSEMBLÉON CONVERTS A-SERIES INTO IC SHOOTER, SHOWS AT NEPCON
- ASSEMBLÉON INTRODUCES NEW IFLEX PICK & PLACE PLATFORM, INCREASING PCBA PRODUCTIVITY BY 30%
- ASSEMBLÉON PROMOTES INTEGRATED PICK & PLACE APPROACH AT NEPCON SOUTH-CHINA IN SHENZHEN
- Assembléon to address sustainability and flexible changeovers at NEPCON South China and IPC Midwest
- ASSEMBLÉON WELCOMES NEW CEO
- ASSEMBLÉON PARTNERS WITH VALOR
- REDUCING CAPITAL COSTS OF EQUIPMENT ASSEMBLY
- ASSEMBLÉON TO ENTER SEMICON INDUSTRY, INTRODUCING DEDICATED SOLUTION FOR SiP, MCM AND DIE BONDING
- ASSEMBLÉON LAUNCHES NEW SERVICES FOR ITS A-SERIES AT PRODUCTRONICA
- EUROPEAN INTRODUCTION OF THE MOST COMPACT PICK & PLACE PLATFORM AT SMT NUREMBERG
- ASSEMBLÉON AIMS TO CUT PICK & PLACE OPERATING COSTS BY 30%
- HIGH TECH CONSORTIUM STARTS SUPREME PROJECT
- ASSEMBLÉON JOINS SUSTAINABLE ELECTRONICS MANUFACTURING WORKING GROUP
- INVENTIVE FINANCING WITH TRUE CAPACITY ON DEMAND
- ASSEMBLÉON ROBOT REDUCES COST OF MEMORY MODULE AND BACK-END SEMICONDUCTOR MANUFACTURING
- NEW SOFTWARE FOR ASSEMBLÉON’S A-SERIES CUTS NPI TIME BY 30%
- ASSEMBLÉON INTRODUCES EUROPEAN WEB SHOP
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March/April 2012
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