Product Positioning
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AX-201: Extremely Versatile
- Configurable up to 11K components per hour
- Chip and IC capabilities starting from 01005 (0402 metric) and a placement force starting from 1.5N.
- Oddform capabilities for components up to 79 mm x 130 mm and 40 mm high (or 25 mm over 25 mm) with a maximum placement force of 40 N
- Die Handling capabilities with bump sizes down to 80 micron, bump pitches down to 160 micron and a placement force starting 0.9 N (Placement forces starting 0.06 N on request).
- Up to 212 tape feeding positions and/or up to 376 trays (Jedec sized)
- 20 micron accuracy and 9 micron repeatability
AX-301/501: From High Flexibility to High Volume
- Configurable in small steps up to 77K components per hour (IPC 9850 reference) for the AX-301 or in the same small steps up to 121K components per hour for the AX-501.
- No compromise in output for a component range from 01005 (0402 metric) to 45 mm x 45 mm x 10.5 mm with a placement force down to 1.5 N
- Die handling capabilities with bump sizes down to 30 micron and bump interspacing down to 60 micron with a placement force down to 1.5 N
- Up to 156 Tape Feeding positions on the AX-301 or 260 on the AX-501. Via an extension module, the AX can be extended by another 47 Tray Positions.
- 40 micron accuracy
