Assembléon

A-Series Hybrid

Reduce your SiP, MCM and flip chip production costs

Where different equipment were used to place chips and known good dies for manufacturing of SiP, MCM and high performance flip chip modules,  this can now be done on one single machine.

The A-Series Hybrid, with its unique parallel placement process capabilities and high accuracy robots, combines the requirements of reliable high speed chipshooting and accurate flip chip placement into a one single machine solution.


Single machine solution for high speed chip shooting and flip chip bonding
• Up to 13,500 cph (IPC 9850) flip chip bonding speeds
• Up to 121,000 cph (IPC 9850) chipshooting speeds


High quality placement process
• 10 micron accuracy
• Closed loop placement force feedback on every placed component    
• >98% first pass yield (* at 2,000 component per panel)

Assembléon's A-Series Hybrid: a single machine solution

• Per robot: 1 head, 1 nozzle, 1 component for full process control of that single
  component
• Up to 3 parallel working twin die bonding robots for known good die placement rates
  of up to 13,500 cph (IPC 9850)
• Up to 20 parallel working standard robots for passive placement rates of up to
  121,000 cph (IPC 9850)


Controlled pick and place process for >99.99% first pass yield

Controlled pick of component
• Closed loop controlled pick
 - No impact force during picking 
 - No component damage

Controlled movement of component
• Continuous monitoring of component
• Device specific accelleration and decelleration profile

Controlled dip fluxing
• No impact force during dipping
• Controlled dip process and die extraction from dip station
• Even flux distribution on all bumps

Closed loop controlled placement
• Advanced board collision detection mechanism
• No impact force = no damaged components
• Closed loop controlled programmable placement force