Thanks to a high precision single placement beam that carries eight
independent Z-servo controlled heads, the MG-1R provides a perfect balance
between chip and IC shooting. It is available in two versions: one with a
Flying Nozzle Change (FNC) head for when many nozzle changes are needed and
high output is important, the other with a Super Fine (SF) head for use
with a wider component range including QFPs, connectors and tall
components.
With placement rates up to 24k components per hour, the MG-1R is fast.
Placement accuracy is 50 microns for chips. It handles a wide range of
components from 01005 to large connectors (100 x 45mm), fine-pitch and
components up to 15mm tall. The MG-1R holds up to 160 twin tapes and 96
single tapes, including stick and tray parts.
Main benefits
The standard comes with software and hardware features to improve product
quality, increase production efficiency and reduces maintenance, including:
- Z-Servo controlled placement heads for accurate stress-free component
mounting
- Automatic board width and thickness adjustment for fast changeover
- Automatic nozzle cleaning station
- Automatic temperature feedback to compensate for temperature variations
- Fiducial recovery function that eliminates the need to remove and clean
the PCB
- Feeder indicators that facilitate easy setup and reduce feeder setup
View video of MG-1R