The next step in Thin Component Placement

Assembléon is working in a project with the Fraunhofer-Institut für Zuverlässigkeit und Mikro integration (IZM) for embedding extremely thin dies into flex circuits. Assembléon’s main challenge is to place 20mm thin components into highly viscous glue without damaging the very fragile dies. During this process, splattering of the glue must be prevented. The Fraunhofer Institute already did several trials with competitor equipment (ASM, Datacon) in their laboratories, but where unsuccessful.
 
Ultimately, up to 4 layers of these components will be laminated into one thin (± 100 - 120µm) PCB. After singulation the end product will be a memory Chip for hearing aids.
This new packaging concept is expected to be a good alternative to the Through Silicon Via (TSV) technology. A big advantage is that this process can be done in the Back end of line, where TSV has to be done in front end, and thus is more expensive.


Fig.1 : 20mm thin component                                    Fig.2 : Ceramic heating device
 
To obtain a sufficiently tacky placement surface, the flex foil has to be pre-heated to 120^oC.  A ceramic heating device is mounted in the AX Hybrid to enable this pre-heating.
Our Assembléon Pick &Place technology has proven to be the perfect fit for this challenge. The only modifications required to deal with the Fraunhofer components was the introduction of a special heat resistant whitenozzle tip on top of a standard spring-loaded toolbits and the fabrication of a special tray.

           
Fig.3 : Special toolbit                               Fig.4 : AX Hybrid in action

The tests so far are every promising: After placement no visible component damage is found.

Later this year, a white paper will be published with details of the principle and process, results, and the cooperation between Fraunhofer IZM with Assembléon.


Patrick Huberts, Wessel Wesseling and Peter van Hoogstraten