Assembléon

High-resolution digital line array camera

Main benefits

  • Mounting accuracy for chips (including 01005): 50 micron
  • Mounting accuracy for QFP: 30 micron
  • Board Quality: automatic detection of missing balls or damaged leads

The M-Series machines come fully equipped with a standard component library. There is no need to start teaching common components. Fast and high speed component alignment is achieved with a revolutionary line array camera system. In one rapid movement, the component are aligned on-the-fly.

On-the-fly movement over camera

Illumination

The high-resolution camera is equipped with a multi-angle illumination unit, able to illuminate any component type for the best results in aligning and recognition. Light intensity is software controlled and optimized per component type.

Additionally, a check can be performed on:

  • Lead / ball pitch
  • Lead / ball location
  • Bent leads or missing leads
  • Missing balls
  • Total number of leads / balls
  • Cumulative lead / ball pitch

       
Reflective illumination                      Side illumination

Beside the line array camera, the following alignment systems are also available to the M-Series machines.