Thanks to a high precision single placement beam that carries eight independent Z-servo controlled heads, the MG-1R provides a perfect balance between chip and IC shooting. It is available in two versions: one with a Flying Nozzle Change (FNC) head for when many nozzle changes are needed and high output is important, the other with a Super Fine (SF) head for use with a wider component range including QFPs, connectors and tall components.

With placement rates up to 24k components per hour, the MG-1R is fast. Placement accuracy is 30 microns for ICs. It handles a wide range of components from 01005 to large connectors (45 x 100 mm), fine-pitch and components up to 15 mm tall. The MG-1R holds up to 96 tape feeders, including stick and bulk parts.

Main benefits:

The standard comes with software and hardware features to improve product quality, increase production efficiency and reduces maintenance, including:

- Z-Servo controlled placement heads for accurate stress-free component mounting
- Automatic board width and thickness adjustment for fast changeover
- Automatic nozzle cleaning station
- Automatic temperature feedback to compensate for temperature variations
- Fiducial recovery function that eliminates the need to remove and clean the PCB
- Feeder indicators that facilitate easy setup and reduce feeder setup
- Double board support system for reducing board transfer time