The Topaz-XII has been continuously improved for nearly a decade, and is a proven machine that remains on the leading edge of Pick & Place technology. Electronics manufactures choose the Topaz-XII as a workhorse for their assembly activity as it provides a perfect balance between high speed and high accuracy. It also offers affordability, reliability and outstanding quality of placement.
The Topaz-XII provides a perfect balance between chip and IC shooting thanks to its high precision single placement beam with eight independent controlled heads. The Topaz-XII is available in two versions. When many nozzle changes are needed and high output is important, the Flying Nozzle Change (FNC) head is recommended. For handling a wider component range including QFP, connectors and high components, the Super Fine head is ideal.
The high-precision single placement beam carries either four FNC heads (each with three nozzles) and four standard heads or eight Super Fine heads with exchangeable nozzles. The FNC heads exchange nozzles on the fly to increase overall machine efficiency.
With placement rates up to 20k components per hour, the Topaz-XII is fast. Placement accuracy is 35 microns for ICs. It handles components ranging from 01005 to large connectors (45 x 100 mm), fine-pitch and components up to 15 mm tall. The Topaz-XII holds up to 90 tape feeders, including stick and bulk parts.
